No Clean Flux Gel NC254 Syringe 10cc
NC254 Flux Gel is a no clean tacky/rework flux paste designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC254 Flux Gel may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. The superior wetting ability of NC254 Flux Gel results in bright, smooth and shiny solder joints whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin probed during in-circuit test. NC254 Flux Gel is compatible with all tin-lead and lead-free alloys and is suitable for a wide range of applications. NC254 Flux Gel can be brushed, dispensed, pin transferred, or stencil printed.
Features
* Excellent wetting
* Wide process wetting
* Tin-lead and Lead-free compatible
Flux Application
* When being used in rework, application should be limited to the area being worked
* Application via dispense needle, brush or cotton swab is recommended
* NC254 Flux Gel needs to see an SMT style reflow profile to render it fully inactive
Cleaning
*NC254 Flux Gel can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner.
Physical Properties
* J-STD-004B – ROL0
* Acid Number – 84.97 mg KOH per gram flux
* Viscosity – Gel-like consistency
* Residues – Clear, Colourless
Handling & Storage
NC254 Flux Gel has a refrigerated shelf life of 1 year at 4°C (40°F) to 12°C (55°F), and 6 months at room temperature. Allow the flux paste to warm up completely and naturally to ambient temperature (2hours) prior to use. Do not store new and used flux paste in the same container.
Safety
Use with adequate ventilation and proper personal protective equipment. Refer to the accompanying Material Safety Data Sheet for any specific emergency information. Do not dispose of any hazardous materials in non-approved containers.
